Automotive Medical Industrial IoT Controller Device PCBA Solutions
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Product Details
| Customization: | Available |
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| Metal Coating: | Copper |
| Mode of Production: | SMT |
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Basic Info.
- Model NO.
- PCBA OEM
- Layers
- Multilayer
- Base Material
- FR-4
- Certification
- RoHS, CCC, ISO
- Customized
- Customized
- Condition
- New
- Board Size
- Customization
- Copper Thickness
- 0.5-6 Oz
- Service
- PCB&PCBA One-Stop Turnkey Service
- Connector
- Type C/USB/Micro USB/WiFi
- Layer
- 1-22 Layers
- Testing Service
- 100%
- Solder Mask Color
- Green, Yellow, White, Blue, Black, Red...
- Board Thickness
- 0.3 mm- 4 mm
- Surface Finishing
- OSP, Lead Free HASL, Enig, Immersion Tin, Gold PLA
- Impedance Control
- Support
- PCBA Assembly
- Welcome, SMT and DIP Soldering
- Customize
- Avaliable
- MOQ
- 1PCS
- Best Price
- Please Contact Us
- Delivery Time
- Sample Is Available Within 3days
- Transport Package
- Box Packing
- Specification
- Customize
- Trademark
- GW
- Origin
- Guangdong, China
- Production Capacity
- 50000
Packaging & Delivery
- Package Size
- 20.00cm * 20.00cm * 20.00cm
- Package Gross Weight
- 5.000kg
Product Description
Product Description
Our advantages
Powerful Production Capacity
Equipped with 7 fully automatic SMT lines and 3 DIP lines, our facility supports a full spectrum of manufacturing requirements—from rapid prototyping to high-volume mass production. These advanced lines enable high-speed, high-precision component placement, stable throughput, and consistent product quality. Our scalable infrastructure allows us to flexibly adjust capacity to meet urgent delivery demands while maintaining rigorous process control across every production stage.
Full Supply Chain Management
We specialize in comprehensive Components Sourcing and CKD (Completely Knocked Down) Kits management, providing end-to-end support for a wide range of electronic manufacturing requirements. In addition to strong relationships with global distributors such as DigiKey, Mouser, and Arrow, we collaborate with authorized dealers and franchise partners of major semiconductor and IC brands, including Texas Instruments, STMicroelectronics, Microchip, Infineon, and Analog Devices. These diversified sourcing channels ensure supply stability, full traceability, and guaranteed authenticity of all components. Our experienced procurement team oversees cost optimization, lead-time management, quality verification, and logistics coordination, enabling customers to simplify their supply chains, mitigate sourcing risks, and maintain consistently high product reliability.
Quality Assurance
ISO9001, UL, RoHS, and TS16949 certified, our operations adhere to internationally recognized quality and safety standards across the entire manufacturing lifecycle. We enforce strict process controls and comprehensive documentation to ensure full compliance and traceability. Every board undergoes a complete suite of inspections, including AOI for visual and solder-joint accuracy, X-Ray for high-density and hidden-lead component validation, and ICT testing for electrical performance and functional integrity. This multilayer testing framework ensures that each product shipped meets rigorous reliability, durability, and performance requirements.
Certifications
Technical Capabilities
PCB Capability | |||
Features | Rigid PCB | FLEX PCB | RIGID-FLEX PCB |
Max Layer | 42L | 8L | 36L |
Max. Panel Size | 600*770mm(23.62″*30.31″)500*1200mm(19.69″*47.24″) | 500*1200mm(19.69″*47.24″) | 500*1200mm(19.69″*47.24″) |
Inner Layer Min Trace/Space | 2.5/2.5mil | 3/3mil | 3/3mil |
Out Layer Min Trace/Space | 3/3mil | 3.5/4mil | 3.5/4mil |
Inner Layer Max Copper | 85oz | 2oz | 6oz |
Out Layer Max Copper | 85oz | 2oz | 3oz |
Min Mechanical Drilling | 0.1mm | 0.1mm | 0.1mm |
Min Laser Drilling | 0.075mm | 0.1mm | 0.075mm |
Max Aspect Ratio(Mechanical Drilling) | 20:1 | 10:1 | 12:1 |
Max Aspect Ratio(Laser Drilling) | 1:1 | / | 1:1 |
Press Fit Hole Ttolerance | ±0.05mm | ±0.05mm | ±0.05mm |
PTH Tolerance | ±0.075mm | ±0.075mm | ±0.075mm |
NPTH Tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
Countersink Tolerance | ±0.15mm | ±0.15mm | ±0.15mm |
Board Thickness | 0.4-11.5mm | 0.1-0.5mm | 0.4-8mm |
Min Board Thickness Tolerance(<1.0mm) | ±0.08mm | ±0.05mm | ±0.08mm |
Impedance Tolerance | Single-Ended:±5Ω(≤50Ω),±7%(>50Ω) | Single-Ended:±5Ω(≤50Ω),±10%(>50Ω) | Single-Ended:±5Ω(≤50Ω),±10%(>50Ω) |
Differential:±5Ω(≤50Ω),±7%(>50Ω) | Differential:±5Ω(≤50Ω),±10%(>50Ω) | Differential:±5Ω(≤50Ω),±10%(>50Ω) | |
Min Board Size | 10*10mm | 5*10mm | 10*10mm |
Max Board Size | 22.5*30inch | 9.8*19.8inch | 22.5*30inch |
Contour Tolerance | ±0.1mm | ±0.05mm | ±0.1mm |
Min BGA | 7mil | 7mil | 7mil |
Min SMT | 7*10mil | 7*10mil | 7*10mil |
Surface Treatment | Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersion Tin,HASL LF,OSP,ENEPIG,Soft gold plating,carbon ink printing,Peelable mask | Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersion Tin,HASL LF,OSP,ENEPIG,Soft gold plating | Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersion Tin,HASL LF,OSP,ENEPIG,Soft gold plating,carbon ink printing,Peelable mask |
Solder Mask | Green,Black,Blue,Red,White, Purpule, Pink, Yellow, Matt black, Matt green,Matt blue,orange, clear or transparent | Green Solder Mask/Black PI/Yellow PI/White PI | Green,Black,Blue,Red,White, Purpule, Pink, Yellow, Matt black, Matt green,Matt blue,orange, clear or transparent |
Min Solder Mask Clearance | 1.5mil | 3mil | 1.5mil |
Min Solder Mask Dam | 3mil | 8mil | 3mil |
Legend | White,Black,Red,Yellow | White,Black,Red,Yellow | White,Black,Red,Yellow |
Min Legend Width/Height | 4/23mil | 4/23mil | 4/23mil |
Min Bending Radius(Single Board) | / | 3-6 x Board Thickness | 3-7 x Flexbile Board Thickness |
Min Bending Radius(Double Side Board) | / | 6-10 x Board Thickness | 6-11 x Flexbile Board Thickness |
Min Bending Radius(Multilayer Board) | / | 10-15 x Board Thickness | 10-16 x Flexbile Board Thickness |
Min Bending Radius(Dynamic Bending) | / | 20-40 x Board Thickness | 20-40 x Board Thickness |
Strain Fillet Width | / | 1.5±0.5mm | 1.5±0.5mm |
Bow & Twist | 0.003 | / | 0.0005 |
Material | |||
Products type | Blind-Buried vias board, Impedance Control, High frequency board, Metal based board with Alumium/copper / | ||
ltem | PCB Assembly Capability | |
1 | Single and double sided SMT/PTH | Yes |
2 | Large parts on both sides, BGA on both sides | Yes |
3 | Min Chips size | 01005 |
4 | Min BGA and Micro BGA pitch and ball counts | 0.008in. (0.2mm) pitch, ball count greater than 1000 |
5 | Min Leaded parts pitch | 0.008 in. (0.2 mm) |
6 | Max Parts size assembly by machine | 2.2 in.x 2.2 in.x0.6 in. |
7 | Assembly surface mount connectors | Yes |
8 | Odd form parts:Resistor and capacitor networks/ Electrolytic capacitors/Variable resistors and capacitors (pots)/Sockets | Yes |
9 | Wave soldering | Yes |
10 | Max PCB size | 14.5 in.x 19.5 in. |
11 | Min PCB Thickness | 0.02 |
12 | Fiducial Marks | Preferred but not required |
13 | PCB Shane | Any |
14 | Panelized PCB | Tab routed/Breakaway tabs/V-Scored/Routed+ V scored |
15 | Inspection | X-ray analysis/Microscopeto20X/100%AOI testing |
16 | Rework | BGA removaland replacement station/SMTIR rework station/Thru-hole |
17 | Min lC Pitch | 0.2mm |
18 | solder paster printer | 0.2mm |
19 | POp Manufacturing capability | POP *3F |
Manufacturing Flow & Equipment
PCB Production Process Overview
Engineering Review (DFM/CAM)
File verification, manufacturability check, and production data preparation.
Material Preparation
Selection and preprocessing of copper-clad laminates and panels.
Inner Layer Imaging & Etching
Pattern transfer and etching to form inner layer circuits.
Layer Alignment & Lamination
Precise alignment and bonding of multilayer structures.
Drilling
CNC drilling and laser microvia formation for interconnections.
Copper Plating & Via Metallization
Plating processes to create conductive pathways through vias.
Outer Layer Imaging & Etching
Final circuit patterning on the outer layers.
Solder Mask Application
Coating and curing of solder mask to protect copper surfaces.
Surface Finishing
ENIG, HASL, OSP, or other finishes to ensure solderability.
Silkscreen Printing
Application of component markings and identifiers.
Routing / CNC Profiling
Board shaping, V-cutting, or milling from production panels.
Electrical Testing
Comprehensive testing to detect shorts, opens, and continuity issues.
Final Inspection
Visual and dimensional quality checks before shipment.
File verification, manufacturability check, and production data preparation.
Material Preparation
Selection and preprocessing of copper-clad laminates and panels.
Inner Layer Imaging & Etching
Pattern transfer and etching to form inner layer circuits.
Layer Alignment & Lamination
Precise alignment and bonding of multilayer structures.
Drilling
CNC drilling and laser microvia formation for interconnections.
Copper Plating & Via Metallization
Plating processes to create conductive pathways through vias.
Outer Layer Imaging & Etching
Final circuit patterning on the outer layers.
Solder Mask Application
Coating and curing of solder mask to protect copper surfaces.
Surface Finishing
ENIG, HASL, OSP, or other finishes to ensure solderability.
Silkscreen Printing
Application of component markings and identifiers.
Routing / CNC Profiling
Board shaping, V-cutting, or milling from production panels.
Electrical Testing
Comprehensive testing to detect shorts, opens, and continuity issues.
Final Inspection
Visual and dimensional quality checks before shipment.
PCBA Production Process Overview
Engineering Review (DFM/DFA)
BOM verification, placement review, stencil design, and assembly preparation.
Components Sourcing & Incoming Inspection
Procurement of authorized components and quality checks for authenticity, packaging, and specifications.
Stencil Fabrication
Laser-cut stencil production for accurate solder paste deposition.
Solder Paste Printing
Application of solder paste onto pads using automated printing systems.
SPI (Solder Paste Inspection)
3D inspection to verify paste height, volume, and alignment.
SMT Pick-and-Place
High-speed placement of SMD components according to programming data.
Reflow Soldering
Controlled heating to reflow solder paste and form strong solder joints.
AOI Inspection
Automated optical inspection to detect misalignment, bridges, tombstoning, and other SMT defects.
DIP / Through-Hole Insertion
Automated or manual insertion of through-hole components.
Wave Soldering / Selective Soldering
Soldering processes for DIP components depending on board design.
X-Ray Inspection
Inspection of BGA, QFN, and hidden-lead components to verify solder integrity.
ICT (In-Circuit Test)
Electrical verification of nets, components, and functional parameters.
Functional Test (FCT)
Testing under actual operating conditions to validate performance.
Conformal Coating / Potting (Optional)
Protective coatings for moisture, corrosion, or environmental resistance.
Final Inspection
QC checks including appearance, labeling, and assembly integrity.
Packaging & Shipping
ESD-safe packaging, labeling, and shipment per customer requirements.
BOM verification, placement review, stencil design, and assembly preparation.
Components Sourcing & Incoming Inspection
Procurement of authorized components and quality checks for authenticity, packaging, and specifications.
Stencil Fabrication
Laser-cut stencil production for accurate solder paste deposition.
Solder Paste Printing
Application of solder paste onto pads using automated printing systems.
SPI (Solder Paste Inspection)
3D inspection to verify paste height, volume, and alignment.
SMT Pick-and-Place
High-speed placement of SMD components according to programming data.
Reflow Soldering
Controlled heating to reflow solder paste and form strong solder joints.
AOI Inspection
Automated optical inspection to detect misalignment, bridges, tombstoning, and other SMT defects.
DIP / Through-Hole Insertion
Automated or manual insertion of through-hole components.
Wave Soldering / Selective Soldering
Soldering processes for DIP components depending on board design.
X-Ray Inspection
Inspection of BGA, QFN, and hidden-lead components to verify solder integrity.
ICT (In-Circuit Test)
Electrical verification of nets, components, and functional parameters.
Functional Test (FCT)
Testing under actual operating conditions to validate performance.
Conformal Coating / Potting (Optional)
Protective coatings for moisture, corrosion, or environmental resistance.
Final Inspection
QC checks including appearance, labeling, and assembly integrity.
Packaging & Shipping
ESD-safe packaging, labeling, and shipment per customer requirements.
Application Fields
Applications
Consumer Electronics
PCBA is widely used in smartphones, tablets, wearables, smart home devices, and various personal electronics requiring compact designs and high-volume production.
PCBA is widely used in smartphones, tablets, wearables, smart home devices, and various personal electronics requiring compact designs and high-volume production.
Industrial Automation
Applied in PLCs, motor controllers, sensors, power modules, and industrial IoT equipment that demand durability and long-term operational stability.
Applied in PLCs, motor controllers, sensors, power modules, and industrial IoT equipment that demand durability and long-term operational stability.
Automotive Electronics
Used in ECU modules, ADAS systems, infotainment, battery management systems, and charging infrastructure, requiring high reliability and strict quality standards.
Used in ECU modules, ADAS systems, infotainment, battery management systems, and charging infrastructure, requiring high reliability and strict quality standards.
Medical Devices
Supports patient monitoring systems, diagnostic instruments, portable medical equipment, and wearable health devices with precise and stable performance requirements.
Supports patient monitoring systems, diagnostic instruments, portable medical equipment, and wearable health devices with precise and stable performance requirements.
Communications & Networking
Integrated into routers, base stations, optical modules, RF equipment, and 5G infrastructure for high-speed data and signal processing.
Integrated into routers, base stations, optical modules, RF equipment, and 5G infrastructure for high-speed data and signal processing.
Energy & Power Systems
Applied in solar inverters, power supplies, smart meters, and battery storage systems requiring strong safety and efficiency.
Applied in solar inverters, power supplies, smart meters, and battery storage systems requiring strong safety and efficiency.
Aerospace & Defense
Used in navigation systems, control modules, communication units, and monitoring equipment where reliability and robustness are critical.
Used in navigation systems, control modules, communication units, and monitoring equipment where reliability and robustness are critical.
FAQ
ltem | FAQ |
1 | Q: What is needed for a quotation? |
A: Please provide the Gerber file for PCB manufacturing, and the BOM list (Bill of Materials) for components sourcing and assembly. | |
2 | Q: Do you accept small orders? |
A: Yes, we welcome both prototype orders (MOQ 1-5 pcs) and mass production. | |
3 | Q: How do you ensure component quality? |
We only source from authorized distributors and original manufacturers. No fake parts allowed. | |
4 | Q: What is your typical lead time? |
A: PCB fabrication usually takes 3–7 days, and PCBA assembly 7–15 days depending on complexity and component availability. | |
5 | Q: Can you provide both PCB and PCBA services together? |
A: Yes, we offer turnkey services including PCB fabrication, components sourcing, and full assembly. | |
6 | Q: Do you offer functional testing? |
A: Yes, we support ICT, FCT, X-Ray, and customized test procedures based on customer requirements. | |
7 | Q: What file formats do you accept? |
A: We accept Gerber, ODB++, Pick-and-Place files, BOM in Excel/CSV, and assembly drawings in PDF. | |
8 | Q: How do you protect customer data? |
A: All files are kept strictly confidential, and we sign NDAs upon request to safeguard your designs. | |
9 | Q: What types of surface finishes do you support? |
A: We offer ENIG, HASL, lead-free HASL, OSP, ENEPIG, and other finishes suitable for different applications. | |
10 | Q: Can you handle BGA, QFN, or fine-pitch assembly? |
A: Yes, our SMT lines support BGA, QFN, 01005, and other advanced packaging with X-Ray verification. | |
11 | Q: Do you provide conformal coating or potting services? |
A: Yes, we offer conformal coating, potting, and other protective treatments for harsh or high-reliability environments. | |
12 | Q: Can you handle special requirements such as impedance control or HDI boards? |
A: Yes, we support controlled impedance, HDI, blind/buried vias, and other advanced PCB fabrication requirements. |
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