| Customization: | Available |
|---|---|
| Base Material: | FR-4 |
| Board Thickness: | 0.3 mm- 4 mm |
|
Still deciding? Get samples of US$ 4.5/Piece
Request Sample
|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
|
Pcb Assembly Capability
|
|
|
|
Single and double sided SMT/PTH
|
Yes
|
|
|
Large parts on both sides, BGA on both sides
|
Yes
|
|
|
Min Chips size
|
01005
|
|
|
Min BGA and Micro BGA pitch and ball counts
|
0.008 in. (0.2mm) pitch, ball count greater than 1000
|
|
|
Min Leaded parts pitch
|
0.008 in. (0.2 mm)
|
|
|
Max Parts size assembly by machine
|
2.2 in. x 2.2 in. x 0.6 in.
|
|
|
Assembly surface mount connectors
|
Yes
|
|
|
Odd form parts:Resistor and capacitor networks/ Electrolytic capacitors/Variable resistors and capacitors (pots)/Sockets
|
Yes
|
|
|
Wave soldering
|
Yes
|
|
|
Max PCB size
|
14.5 in. x 19.5 in.
|
|
|
Min PCB Thickness
|
0.02
|
|
|
Fiducial Marks
|
Preferred but not required
|
|
|
PCB Shape
|
Any
|
|
|
Panelized PCB
|
Tab routed/Breakaway tabs/V-Scored/Routed+ V scored
|
|
|
Inspection
|
X-ray analysis/Microscope to 20X /100% AOI testing
|
|
|
Rework
|
BGA removal and replacement station/SMT IR rework station/Thru-hole rework station
|
|
|
Min IC Pitch
|
0.2mm
|
|
|
solder paster printer
|
0.2mm
|
|
|
POP Manufacturing capability
|
POP *3F
|
|
){kind=link}