Custom Flexible Integrated Printed Electronic Circuit

Product Description

Product Description

Our advantages

Powerful Production Capacity

Equipped with 7 fully automatic SMT lines and 3 DIP lines, our facility supports a full spectrum of manufacturing requirements—from rapid prototyping to high-volume mass production. These advanced lines enable high-speed, high-precision component placement, stable throughput, and consistent product quality. Our scalable infrastructure allows us to flexibly adjust capacity to meet urgent delivery demands while maintaining rigorous process control across every production stage.

Full Supply Chain Management

We specialize in comprehensive Components Sourcing and CKD (Completely Knocked Down) Kits management, providing end-to-end support for a wide range of electronic manufacturing requirements. In addition to strong relationships with global distributors such as DigiKey, Mouser, and Arrow, we collaborate with authorized dealers and franchise partners of major semiconductor and IC brands, including Texas Instruments, STMicroelectronics, Microchip, Infineon, and Analog Devices. These diversified sourcing channels ensure supply stability, full traceability, and guaranteed authenticity of all components. Our experienced procurement team oversees cost optimization, lead-time management, quality verification, and logistics coordination, enabling customers to simplify their supply chains, mitigate sourcing risks, and maintain consistently high product reliability.

Quality Assurance

ISO9001, UL, RoHS, and TS16949 certified, our operations adhere to internationally recognized quality and safety standards across the entire manufacturing lifecycle. We enforce strict process controls and comprehensive documentation to ensure full compliance and traceability. Every board undergoes a complete suite of inspections, including AOI for visual and solder-joint accuracy, X-Ray for high-density and hidden-lead component validation, and ICT testing for electrical performance and functional integrity. This multilayer testing framework ensures that each product shipped meets rigorous reliability, durability, and performance requirements.

Certifications

Technical Capabilities

PCB Capability
Features	Rigid PCB	FLEX PCB	RIGID-FLEX PCB
Max Layer	42L	8L	36L
Max. Panel Size	600*770mm(23.62″*30.31″)500*1200mm(19.69″*47.24″)	500*1200mm(19.69″*47.24″)	500*1200mm(19.69″*47.24″)
Inner Layer Min Trace/Space	2.5/2.5mil	3/3mil	3/3mil
Out Layer Min Trace/Space	3/3mil	3.5/4mil	3.5/4mil
Inner Layer Max Copper	85oz	2oz	6oz
Out Layer Max Copper	85oz	2oz	3oz
Min Mechanical Drilling	0.1mm	0.1mm	0.1mm
Min Laser Drilling	0.075mm	0.1mm	0.075mm
Max Aspect Ratio(Mechanical Drilling)	20:1	10:1	12:1
Max Aspect Ratio(Laser Drilling)	1:1	/	1:1
Press Fit Hole Ttolerance	±0.05mm	±0.05mm	±0.05mm
PTH Tolerance	±0.075mm	±0.075mm	±0.075mm
NPTH Tolerance	±0.05mm	±0.05mm	±0.05mm
Countersink Tolerance	±0.15mm	±0.15mm	±0.15mm
Board Thickness	0.4-11.5mm	0.1-0.5mm	0.4-8mm
Min Board Thickness Tolerance(<1.0mm)	±0.08mm	±0.05mm	±0.08mm
Impedance Tolerance	Single-Ended:±5Ω(≤50Ω),±7%(>50Ω)	Single-Ended:±5Ω(≤50Ω),±10%(>50Ω)	Single-Ended:±5Ω(≤50Ω),±10%(>50Ω)
	Differential:±5Ω(≤50Ω),±7%(>50Ω)	Differential:±5Ω(≤50Ω),±10%(>50Ω)	Differential:±5Ω(≤50Ω),±10%(>50Ω)
Min Board Size	10*10mm	5*10mm	10*10mm
Max Board Size	22.5*30inch	9.8*19.8inch	22.5*30inch
Contour Tolerance	±0.1mm	±0.05mm	±0.1mm
Min BGA	7mil	7mil	7mil
Min SMT	7*10mil	7*10mil	7*10mil
Surface Treatment	Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersion Tin,HASL LF,OSP,ENEPIG,Soft gold plating,carbon ink printing,Peelable mask	Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersion Tin,HASL LF,OSP,ENEPIG,Soft gold plating	Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersion Tin,HASL LF,OSP,ENEPIG,Soft gold plating,carbon ink printing,Peelable mask
Solder Mask	Green,Black,Blue,Red,White, Purpule, Pink, Yellow, Matt black, Matt green,Matt blue,orange, clear or transparent	Green Solder Mask/Black PI/Yellow PI/White PI	Green,Black,Blue,Red,White, Purpule, Pink, Yellow, Matt black, Matt green,Matt blue,orange, clear or transparent
Min Solder Mask Clearance	1.5mil	3mil	1.5mil
Min Solder Mask Dam	3mil	8mil	3mil
Legend	White,Black,Red,Yellow	White,Black,Red,Yellow	White,Black,Red,Yellow
Min Legend Width/Height	4/23mil	4/23mil	4/23mil
Min Bending Radius(Single Board)	/	3-6 x Board Thickness	3-7 x Flexbile Board Thickness
Min Bending Radius(Double Side Board)	/	6-10 x Board Thickness	6-11 x Flexbile Board Thickness
Min Bending Radius(Multilayer Board)	/	10-15 x Board Thickness	10-16 x Flexbile Board Thickness
Min Bending Radius(Dynamic Bending)	/	20-40 x Board Thickness	20-40 x Board Thickness
Strain Fillet Width	/	1.5±0.5mm	1.5±0.5mm
Bow & Twist	0.003	/	0.0005
Material
Products type	Blind-Buried vias board, Impedance Control, High frequency board, Metal based board with Alumium/copper /

ltem	PCB Assembly Capability
1	Single and double sided SMT/PTH	Yes
2	Large parts on both sides, BGA on both sides	Yes
3	Min Chips size	01005
4	Min BGA and Micro BGA pitch and ball counts	0.008in. (0.2mm) pitch, ball count greater than 1000
5	Min Leaded parts pitch	0.008 in. (0.2 mm)
6	Max Parts size assembly by machine	2.2 in.x 2.2 in.x0.6 in.
7	Assembly surface mount connectors	Yes
8	Odd form parts:Resistor and capacitor networks/ Electrolytic capacitors/Variable resistors and capacitors (pots)/Sockets	Yes
9	Wave soldering	Yes
10	Max PCB size	14.5 in.x 19.5 in.
11	Min PCB Thickness	0.02
12	Fiducial Marks	Preferred but not required
13	PCB Shane	Any
14	Panelized PCB	Tab routed/Breakaway tabs/V-Scored/Routed+ V scored
15	Inspection	X-ray analysis/Microscopeto20X/100%AOI testing
16	Rework	BGA removaland replacement station/SMTIR rework station/Thru-hole
17	Min lC Pitch	0.2mm
18	solder paster printer	0.2mm
19	POp Manufacturing capability	POP *3F

Manufacturing Flow & Equipment

PCB Production Process Overview

Engineering Review (DFM/CAM)
File verification, manufacturability check, and production data preparation.
Material Preparation
Selection and preprocessing of copper-clad laminates and panels.
Inner Layer Imaging & Etching
Pattern transfer and etching to form inner layer circuits.
Layer Alignment & Lamination
Precise alignment and bonding of multilayer structures.
Drilling
CNC drilling and laser microvia formation for interconnections.
Copper Plating & Via Metallization
Plating processes to create conductive pathways through vias.
Outer Layer Imaging & Etching
Final circuit patterning on the outer layers.
Solder Mask Application
Coating and curing of solder mask to protect copper surfaces.
Surface Finishing
ENIG, HASL, OSP, or other finishes to ensure solderability.
Silkscreen Printing
Application of component markings and identifiers.
Routing / CNC Profiling
Board shaping, V-cutting, or milling from production panels.
Electrical Testing
Comprehensive testing to detect shorts, opens, and continuity issues.
Final Inspection
Visual and dimensional quality checks before shipment.

PCBA Production Process Overview

Engineering Review (DFM/DFA)
BOM verification, placement review, stencil design, and assembly preparation.
Components Sourcing & Incoming Inspection
Procurement of authorized components and quality checks for authenticity, packaging, and specifications.
Stencil Fabrication
Laser-cut stencil production for accurate solder paste deposition.
Solder Paste Printing
Application of solder paste onto pads using automated printing systems.
SPI (Solder Paste Inspection)
3D inspection to verify paste height, volume, and alignment.
SMT Pick-and-Place
High-speed placement of SMD components according to programming data.
Reflow Soldering
Controlled heating to reflow solder paste and form strong solder joints.
AOI Inspection
Automated optical inspection to detect misalignment, bridges, tombstoning, and other SMT defects.
DIP / Through-Hole Insertion
Automated or manual insertion of through-hole components.
Wave Soldering / Selective Soldering
Soldering processes for DIP components depending on board design.
X-Ray Inspection
Inspection of BGA, QFN, and hidden-lead components to verify solder integrity.
ICT (In-Circuit Test)
Electrical verification of nets, components, and functional parameters.
Functional Test (FCT)
Testing under actual operating conditions to validate performance.
Conformal Coating / Potting (Optional)
Protective coatings for moisture, corrosion, or environmental resistance.
Final Inspection
QC checks including appearance, labeling, and assembly integrity.
Packaging & Shipping
ESD-safe packaging, labeling, and shipment per customer requirements.

Application Fields

Applications

Consumer Electronics
PCBA is widely used in smartphones, tablets, wearables, smart home devices, and various personal electronics requiring compact designs and high-volume production.

Industrial Automation
Applied in PLCs, motor controllers, sensors, power modules, and industrial IoT equipment that demand durability and long-term operational stability.

Automotive Electronics
Used in ECU modules, ADAS systems, infotainment, battery management systems, and charging infrastructure, requiring high reliability and strict quality standards.

Medical Devices
Supports patient monitoring systems, diagnostic instruments, portable medical equipment, and wearable health devices with precise and stable performance requirements.

Communications & Networking
Integrated into routers, base stations, optical modules, RF equipment, and 5G infrastructure for high-speed data and signal processing.

Energy & Power Systems
Applied in solar inverters, power supplies, smart meters, and battery storage systems requiring strong safety and efficiency.

Aerospace & Defense
Used in navigation systems, control modules, communication units, and monitoring equipment where reliability and robustness are critical.

FAQ

ltem	FAQ
1	Q: What is needed for a quotation?
	A: Please provide the Gerber file for PCB manufacturing, and the BOM list (Bill of Materials) for components sourcing and assembly.
2	Q: Do you accept small orders?
	A: Yes, we welcome both prototype orders (MOQ 1-5 pcs) and mass production.
3	Q: How do you ensure component quality?
	We only source from authorized distributors and original manufacturers. No fake parts allowed.
4	Q: What is your typical lead time?
	A: PCB fabrication usually takes 3–7 days, and PCBA assembly 7–15 days depending on complexity and component availability.
5	Q: Can you provide both PCB and PCBA services together?
	A: Yes, we offer turnkey services including PCB fabrication, components sourcing, and full assembly.
6	Q: Do you offer functional testing?
	A: Yes, we support ICT, FCT, X-Ray, and customized test procedures based on customer requirements.
7	Q: What file formats do you accept?
	A: We accept Gerber, ODB++, Pick-and-Place files, BOM in Excel/CSV, and assembly drawings in PDF.
8	Q: How do you protect customer data?
	A: All files are kept strictly confidential, and we sign NDAs upon request to safeguard your designs.
9	Q: What types of surface finishes do you support?
	A: We offer ENIG, HASL, lead-free HASL, OSP, ENEPIG, and other finishes suitable for different applications.
10	Q: Can you handle BGA, QFN, or fine-pitch assembly?
	A: Yes, our SMT lines support BGA, QFN, 01005, and other advanced packaging with X-Ray verification.
11	Q: Do you provide conformal coating or potting services?
	A: Yes, we offer conformal coating, potting, and other protective treatments for harsh or high-reliability environments.
12	Q: Can you handle special requirements such as impedance control or HDI boards?
	A: Yes, we support controlled impedance, HDI, blind/buried vias, and other advanced PCB fabrication requirements.