| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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| Pcb Assembly Capability | |
| Single and double sided SMT/PTH | Yes |
| Large parts on both sides, BGA on both sides | Yes |
| Min Chips size | 01005 |
| Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
| Min Leaded parts pitch | 0.008 in. (0.2 mm) |
| Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. |
| Assembly surface mount connectors | Yes |
| Odd form parts:Resistor and capacitor networks/ Electrolytic capacitors/Variable resistors and capacitors (pots)/Sockets | Yes |
| Wave soldering | Yes |
| Max PCB size | 14.5 in. x 19.5 in. |
| Min PCB Thickness | 0.02 |
| Fiducial Marks | Preferred but not required |
| PCB Shape | Any |
| Panelized PCB | Tab routed/Breakaway tabs/V-Scored/Routed+ V scored |
| Inspection | X-ray analysis/Microscope to 20X /100% AOI testing |
| Rework | BGA removal and replacement station/SMT IR rework station/Thru-hole rework station |
| Min IC Pitch | 0.2mm |
| solder paster printer | 0.2mm |
| POP Manufacturing capability | POP *3F |
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