| Customization: | Available |
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| Metal Coating: | Gold |
| Mode of Production: | SMT |
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Pcb Assembly Capability |
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Single and double sided SMT/PTH
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Yes
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Large parts on both sides, BGA on both sides
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Yes
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Min Chips size
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01005
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Min BGA and Micro BGA pitch and ball counts
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0.008 in. (0.2mm) pitch, ball count greater than 1000
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Min Leaded parts pitch
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0.008 in. (0.2 mm)
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Max Parts size assembly by machine
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2.2 in. x 2.2 in. x 0.6 in.
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Assembly surface mount connectors
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Yes
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Odd form parts:Resistor and capacitor networks/ Electrolytic capacitors/Variable resistors and capacitors (pots)/Sockets
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Yes
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Wave soldering
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Yes
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Max PCB size
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14.5 in. x 19.5 in.
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Min PCB Thickness
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0.02
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Fiducial Marks
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Preferred but not required
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PCB Shape
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Retangular, Round, Slots, Cutouts, Complex, Irreg
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Panelized PCB
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Tab routed/Breakaway tabs/V-Scored/Routed+ V scored
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Inspection
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X-ray analysis/Microscope to 20X /100% AOI testing
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Rework
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BGA removal and replacement station/SMT IR rework station/Thru-hole rework station
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Min IC Pitch
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0.2mm
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solder paster printer
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0.2mm
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POP Manufacturing capability
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POP *3F
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